The 10 Mistakes
- ▸1. Missing decoupling caps — 100nF ceramic on every IC VCC pin
- ▸2. Wrong footprint — always verify with physical part before ordering
- ▸3. Thin power traces — use 1mm per amp minimum
- ▸4. No ground plane — use copper pour for return paths and noise reduction
- ▸5. Decoupling caps too far from IC — must be adjacent to power pin
- ▸6. Floating inputs — tie unused inputs to VCC or GND via 10kΩ
- ▸7. No test points — add 1mm pads on all important signals
- ▸8. Silkscreen over pads — keep silkscreen 0.1mm away from all pads
- ▸9. Incorrect connector pinout — verify mating direction with physical connector
- ▸10. No mechanical check — verify board fits enclosure in 3D view
💡 Tip: Run DRC, do a 3D mechanical check, and have someone else review — in that order — before sending to fab.